InterPACK International Conference on Electronics Packaging 2015

This is the first time that the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) and the International Conference on Nanochannels, Microchannels and Minichannels (ICNMM) will jointly hold their conferences together.

InterPACK is the premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging, MEMS, and NEMS. It is the flagship conference of the Electronics and Photonics Packaging Division (EPPD). The InterPACK conference series was founded in 1992 as the ASME-JSME Joint Electronics Packaging Conference. It was renamed InterPACK in 1995 and has occurred biannually since then. The conference is held in technical co-operation with the Japanese Society of Mechanical Engineering (JSME). InterPACK attracts researchers and practitioners from academia, industry, and government and serves as a venue for knowledge dissemination and collaboration amongst its participants.

Conference Topics

-Advanced Electronics and Photonics: Packaging, Interconnect and Reliability
-Emerging Technology Frontiers
-MEMS and NEMS
-Thermal Management
-Thermal Management Using Micro Channels, Jets, Sprays
-Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales
-Advanced Fabrication and Manufacturing
-Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices
Panels
-Technology Update Talks
-Mini Workshops and Tutorials
-Student Poster and Networking Session
-Exhibits, Vendors, and Sponsors (Technical Presentation)
-Advanced Electronics and Photonics, Packaging Materials and Processing