International Conference on IC Design and Technology - ICICDT 2012

Global Forum for Interaction and Collaboration:
The International Conference on IC Design and Technology is the global forum for interaction and collaboration of IC design and technology for "accelerating product time-to-market". Close collaboration of the multi-discipline technical fields - design/device/process - accelerates the implementation of new designs and new technologies into manufacturing.

IC Trends:
IC industry trends toward specializing system design and manufacturing outsourcing - such as fabless design house, wafer foundry, design automation tool/software house, and semiconductor processing tool supplier - created the needs for individuals with multi-discipline technical skills for collaborations. Furthermore, advanced IC technology no longer can offer the same level of control over many parameters that have direct adverse impact on circuit behavior. New IC designs also push the limit of technology, and in some cases require specific fine-tuning of certain process modules in manufacturing. Thus the traditionally separated communities of design and technology - design/device/process - are increasingly intertwined. Issues that require close interaction and collaboration for trade-off and optimization by all design/device/process fields are addressed in this conference. They are:

Design/device/process optimizations and trade-off for leakage current, power consumption, & noise issues in mixed-signals, large scale IC devices, or design re-use.
Incorporation of new materials (i.e. dual gate, multi-material active layers, etc.) in IC cell library and design of advanced transistor structures (i.e. Double Gate FDSOI, FinFET, etc.).
Implementation of IC design and manufacturing process of new device structures (i.e. PDSOI, FDSOI, MRAM, etc.).