Bondexpo 2010

More information on Bondexpo

Industrial Bonding Technologies on the Advance

With their industry platform for industrial bonding technologies, namely BONDexpo , trade fair promoters P. E. Schall GmbH & Co. KG have succeeded in establishing a new type of “complementary trade fair” within a very short period of time. BONDexpo will take place for the fourth time in 2010. The event documents the necessity for looking beyond one’s own horizon in an impressive fashion, in order to be able to represent production and assembly technology sequences in their entirety.

Just under 100 exhibitors and 37,500 square feet of overall exhibition floor space at the 3rd BONDexpo in crisis year 2009 substantiate the fact that promoting bonding technologies with a separate trade fair isn’t just an attempt to push a trendy topic, and that the process links between manufacturers and suppliers of bonding, insulating, foam, sealing and encapsulation materials, as well as application equipment, and handling within the respective application, are becoming more and more closely related.