Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2010
More information on Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society. Authors are invited to submit papers describing new technical contributions related to the broad area of electrical performance of high-speed designs.
Organizer & Venue for Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
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Venue
Crowne Plaza Hotel Riverwalk
111 Pecan St. E
San Antonio, , USA
Tel: 1-210-3542800
Fax: 1-210-3542700