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IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2010

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Location

Cornul Vanatorului
Bucharest, Romania
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More information on IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME)

The International Symposium for Design and Technology in Electronic Packaging (SIITME) is a premier Central European event in the field of electronics industry, being from 1995 a scientific forum for exchanging of information between academia and industry from Central and Eastern Europe on the topics related to their experimental and theoretical work in the field of electronics and micro-systems, manufacturing technologies and advanced packaging.


Organizer & Venue for IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME)


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Organizer

University of Pitesti
110040 Pitesti Str. Targu din Vale, nr.1, Arges, Romania
Tel: +40 348-453100 Fax: +40 348-453123
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Venue

Cornul Vanatorului
Parcul Trivale Pitesti Arges Romania
Bucharest, , Romania
Tel: 0248 275091
Fax: 0248 275091



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