September 23 - 26, 2010    Bucharest , Romania
The International Symposium for Design and Technology in Electronic Packaging (SIITME) is a premier Central European event in the field of electronics industry, being from 1995 a scientific forum for exchanging of information between academia and industry from Central and Eastern Europe on the topics related to their experimental and theoretical work in the field of electronics and micro-systems, manufacturing technologies and advanced packaging.

Venue

Location: Cornul Vanatorului
Contact Parcul Trivale Pitesti Arges Romania Bucharest , Romania
0248 275091

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