July 3 - 6, 2012    Beijing , China
CHIPF2012 will choose “Better Packaging, More Success” as a theme. The exhibition will focus on packaging design, new packaging materials application, simple packaging concept, packaging recycling and packaging security. In the meanwhile, CHIPF2012 will inherit the good trend that international exhibitors were interested in CHIPF2010, broaden international exchange & cooperation and attract more international packaging firms and users to join CHIPF, making their own contributions to packaging industry development.

Venue

Location: New China International Exhibition Center
The New China International Exhibition Center is established within publicly built business area in the south of Tianzhu Konggang in Shunyi. It is located in the west of Jingshun road, the east of..
Contact No. 88 Yuxiang Rd., Tianzhu, Shunyi Dist., , China Beijing , China
+86-10-66418385 / 66418225 / 66411727

Related events

CHIPF - Beijing International Packaging Fair June 30 - July 2, 2014
CHIPF - Beijing International Packaging Fair July 3 - 6, 2012
Beijing International Packaging Fair June 2 - 4, 2010