Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2013
会议 > Electrical Engineering 会议 > Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
October 27 - 30, 2013
圣何塞 CA , 美国
EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society
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