January 19 - 20, 2016    NO CITY , Francia
This year’s 4th edition of the European 3D Summit will celebrate a rich diversity of 3D Integration technologies. Going beyond Through-Silicon-Via (TSV) technology, SEMI will invite a set of high-profile conference speakers to talk about the full range of cutting-edge technologies being adopted in 3D Integration and miniaturized packaging.

Lugar

Location: Minatec
Contact NO CITY , France

Organizador

Semiconductor Equipment and Material International
San Jose 3081 Zanker Road San Jose, CA 95134, USA
1.408.943.6900

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European 3D Summit January 19 - 20, 2016