October 23 - 26, 2011
EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society. Authors are invited to submit papers describing new technical contributions related to the broad area of electrical performance of high-speed designs.

Venue

Sorry, this event is quite new so we couldn't find any venue information.
Please check again in the near future.

Related events

Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) October 27 - 30, 2015
Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) October 26 - 29, 2014
Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) October 27 - 30, 2013
Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) October 21 - 24, 2012
Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) October 23 - 26, 2011
Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) October 24 - 27, 2010
2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging (EPEP) October 19 - 21, 2009