SMT/HYBRID/PACKAGING - System Integration in Micro Electronics - International Exhibition and Confer 2012
More information on SMT/HYBRID/PACKAGING - System Integration in Micro Electronics - International Exhibition and Confer
SMT Hybrid Packaging is Europe´s
leading event on System Integration in
Micro Electronics.
Meet the industry's leading companies
for SMT-Equipment, Components and
SMT-Services from 8 - 10 May 2012 in
Nuremberg, Germany. With 32% foreign
exhibitors, the event offers not only a
wide, but also an international spectrum.
The perfect platform to get the latest
information on newest trends and
developments!
Organizer & Venue for SMT/HYBRID/PACKAGING - System Integration in Micro Electronics - International Exhibition and Confer
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Venue
Nürnberg Messe
Messezentrum Nürnberg 90471
Nuremberg, Germany
Tel: +49 (0) 9 11. 86 06-0
Fax: +49 (0) 9 11. 86 06-82 28