IC Packaging Technology Expo (ICP) 2012
More information on IC Packaging Technology Expo (ICP)
Gathers wide variety of Packaging Technologies for IC Devices!
All kinds of products, technologies and services that can contribute to miniaturization and thinning of cutting-edge devices such as Semiconductors, LED, Power Devices, Sensors and MEMS will gather here. ICP is an essential business venue for the professionals from a variety of fields to seek for packaging technologies.
Organizer & Venue for IC Packaging Technology Expo (ICP)
| Other events by | Join as organizer
Organizer
Reed Exhibitions Japan
18F Shinjuku-Nomura Bldg., 1-26-2 Nishi-Shinjuku, Shinjuku-ku, Tokyo 163-0570, Japan
Tel: +81-3-3349-8504
Fax: +81-3-3349-8500
Other events in | Join as Venue
Venue
Tokyo Big Sight
3-11-1 Ariake, Koto-ku, Tokyo 135-0063
Tokyo, , Japan
Tel: +81-3-5530-1111