July 17 - 18, 2013    Chicago IL , USA
Competition Is Rampant. Downward pressures on process and margin continue while distribution, material and other input costs are rising with demand.

The manner in which companies choose to convey brand identity and respond to these challenges will shape the future of packaging and the industry for years to come.
Benefits of Attending:

2013′s 2-day format will offer an exclusive senior level experience that focuses directly on effective package development and processes behind crafting the most effective consumer engaging packaging on shelves today.

Venue

Location: Hyatt Regency Chicago
Contact 151 E. Wacker Drive Chicago , USA