European 3D Summit 2016
January 19 - 20, 2016
NO CITY , France
This year’s 4th edition of the European 3D Summit will celebrate a rich diversity of 3D Integration technologies. Going beyond Through-Silicon-Via (TSV) technology, SEMI will invite a set of high-profile conference speakers to talk about the full range of cutting-edge technologies being adopted in 3D Integration and miniaturized packaging.
Organizer
Semiconductor Equipment and Material International
San Jose
3081 Zanker Road
San Jose, CA 95134, USA
1.408.943.6900
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European 3D Summit January 19 - 20, 2016