IC Packaging Technology Expo (ICP) 2011
January 19 - 21, 2011
Tokyo , Giappone
Fatti
Visitatori: 64000
Espositori: 150
All kinds of products, technologies and services; equipment, device and material, that can contribute to miniaturization and thinning of cutting edge devices such as Semiconductors, LED, Power Devices, Sensors and MEMS will gather. ICP is an essential business venue for the specialists from a variety of fields to seek the packaging technology.
Sede
Location: Tokyo Big Sight
The West Exhibition Hall is a two-tier structure that consists of four halls that surround the Atrium. These halls are suitable for small-scale exhibitions and events. Both levels are equipped with..
+81-3-5530-1111
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