International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2013
conferenze > Information Technology conferenze > International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
October 22 - 25, 2013
Taipei , Taiwan
Over the past years, IMPACT conference, a remarkable platform, continually pay attention to the latest trends of global micro-system, packaging and circuit technology, and encourage the development and research of new materials, processes and designs in realizing the versatile system demands for advanced consumer, communication, cloud & mobile computing, medical and automobile applications.
The theme of IMPACT-IAAC 2013 highlights “Green & Cloud: Creating Value and Toward Eco-Life” and will arrange Panel Sessions, invited talks, industrial sessions and outstanding paper presentations. Furthermore, IMPACT keeps collaborating with International organizations such as ICEP from Japan and iNEMI from U.S.A.
The theme of IMPACT-IAAC 2013 highlights “Green & Cloud: Creating Value and Toward Eco-Life” and will arrange Panel Sessions, invited talks, industrial sessions and outstanding paper presentations. Furthermore, IMPACT keeps collaborating with International organizations such as ICEP from Japan and iNEMI from U.S.A.
Sede
Location: TWTC Nangang Exhibition Center
Taipei World Trade Center Nangang Exhibition Hall (TWTC Nangang) is a superimposed purpose-built exhibition complex in Nangang, Taipei, which consists of two exhibition halls one over the other. It is..
(886-2) 2725-5200
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