July 17 - 18, 2013    シカゴ IL , 米国
Competition Is Rampant. Downward pressures on process and margin continue while distribution, material and other input costs are rising with demand.

The manner in which companies choose to convey brand identity and respond to these challenges will shape the future of packaging and the industry for years to come.
Benefits of Attending:

2013′s 2-day format will offer an exclusive senior level experience that focuses directly on effective package development and processes behind crafting the most effective consumer engaging packaging on shelves today.

開催地

Location: Hyatt Regency Chicago
連絡先 151 E. Wacker Drive Chicago , USA

関連イベント