More information on Bondexpo
More and more attention is being focused on industrial bonding technologies.
With their industry platform for industrial bonding technologies, namely BONDexpo, trade fair promoters P. E. Schall GmbH & Co. KG have succeeded in establishing a new type of “complementary trade fair” within a very short period of time. In the year 2012, the 6th BONDexpo will be held at the Stuttgart Exhibition Centre from the 8th through the 11th of October. It will present itself in the usual time-tested fashion concurrent to the 31st MOTEK, leading international trade fair for handling, assembly and automation technology, and will impressively document the necessity for looking beyond one’s own horizons in order to fully represent the production and assembly process sequences.
• List of Exhibitors
3M Deutschland GmbH,AAT Aston GmbH,AB dostec GmbH,ADACTECH Technologies GmbH,adhäsion KLEBEN & DICHTEN,AEC POLYMERS and many more.
6th BONDexpo in 2012:
Trend-Setting Industry Meeting Place for Bonding Technology
Strong development demonstrated by BONDexpo during the course of just five events substantiates its importance for the industry, which will certainly increase in the future as well – especially in light of the fact that the issues involved with bonding and joining new materials represents a genuine challenge for adhesives technology both now and for the future as well. After all, lightweight construction isn’t just an issue for motor vehicles, but rather for equipment and devices in general as well. Future materials and material combinations, as well as hybrid solutions, will offer streamlining and resource potential which can only be taken advantage of through the use of new adhesives.
Organizer & Venue for Bondexpo
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Messepiazza 1, Am Kochenhof 16
Stuttgart, , Germany
Tel: +49 (0)711 18560-2255
Fax: +49 (0)711 18560-2460