Exhibition · Stuttgart, Germany
Bondexpo 2010
Hardware, Tools, Handicraft Equipment · Machine Tools
Key numbers
- Editions on record
- 7first in 2009
About Bondexpo
Industrial Bonding Technologies on the Advance
With their industry platform for industrial bonding technologies, namely BONDexpo , trade fair promoters P. E. Schall GmbH & Co. KG have succeeded in establishing a new type of “complementary trade fair” within a very short period of time. BONDexpo will take place for the fourth time in 2010. The event documents the necessity for looking beyond one’s own horizon in an impressive fashion, in order to be able to represent production and assembly technology sequences in their entirety.
Just under 100 exhibitors and 37,500 square feet of overall exhibition floor space at the 3rd BONDexpo in crisis year 2009 substantiate the fact that promoting bonding technologies with a separate trade fair isn’t just an attempt to push a trendy topic, and that the process links between manufacturers and suppliers of bonding, insulating, foam, sealing and encapsulation materials, as well as application equipment, and handling within the respective application, are becoming more and more closely related.
From our listing of this edition. Details may have changed since.
Editions
| Year | Dates | Where | Exhibitors | Visitors |
|---|---|---|---|---|
| 2015 | 7–10 Oct 2015 | Messe Stuttgart Stuttgart, Germany | — | — |
| 2014 | 7–10 Oct 2014 | Messe Stuttgart Stuttgart, Germany | — | — |
| 2013 | 7–10 Oct 2013 | Messe Stuttgart Stuttgart, Germany | — | — |
| 2012 | 8–11 Oct 2012 | Messe Stuttgart Stuttgart, Germany | — | — |
| 2011 | 10–13 Oct 2011 | Trade Fair Centre Stuttgart Stuttgart, Germany | — | — |
| 2010 | 13–16 Sep 2010 | Messe Stuttgart Stuttgart, Germany | — | — |
| 2009 | 21–24 Sep 2009 | Messe Stuttgart Stuttgart, Germany | — | — |
Past editions from the bvents archive (2008–2019) and organiser figures where they were published.