Electronics Packaging Technology Conference - (EPTC) 2011

Conference Topics
- Advanced Packaging: Wafer level packaging, 3D integration, TSV (through Silicon Via) , embedded passives & actives on substrates, flip chip packaging, RF-ID, 3D SiP, Packaging solutions for MEMS and MOEMS
- Interconnection Technologies: wire bonding technology, flip chip technology, solder alternatives (ICP, ACP, ACF, NCP), and TSV
- Materials & Processes: Materials and processes for traditional and advanced microelectronic systems, 3D packages, MEMS, solar, green and biomedical packaging
- Modeling & Simulations: Electrical modeling & signal integrity, thermal characterization & cooling solutions, mechanical modeling & structural integrity
- Quality & Reliability: Component, board and system level reliability assessment, interfacial adhesion, accelerated testing and models, advances in reliability test methods and failure analysis
- Emerging Technologies: Packaging technologies in biomedical, bioengineering, biosensors and wearable electronics
- Printed Electronics: Printed devices: transistors, batteries and memory, large area printed functional films: lighting, sensors and photovoltaics, solution processing of organic and inorganic materials
- Wafer/Package Testing and Characterization: Highspeed test architectures and systems, test methodologies, probe card design