Conference · Taipei, Taiwan
International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2013
Information Technology · Packaging · Micro & Nano Technologies
Key numbers
- Floor space
- NULLin 2015, organiser's figure
- Editions on record
- 6first in 2010
About International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Over the past years, IMPACT conference, a remarkable platform, continually pay attention to the latest trends of global micro-system, packaging and circuit technology, and encourage the development and research of new materials, processes and designs in realizing the versatile system demands for advanced consumer, communication, cloud & mobile computing, medical and automobile applications.
The theme of IMPACT-IAAC 2013 highlights “Green & Cloud: Creating Value and Toward Eco-Life” and will arrange Panel Sessions, invited talks, industrial sessions and outstanding paper presentations. Furthermore, IMPACT keeps collaborating with International organizations such as ICEP from Japan and iNEMI from U.S.A.
From our listing of this edition. Details may have changed since.
Editions
| Year | Dates | Where | Exhibitors | Visitors |
|---|---|---|---|---|
| 2015 | 22–25 Oct 2015 | TWTC Nangang Exhibition Center Taipei, Taiwan | — | — |
| 2014 | 22–25 Oct 2014 | TWTC Nangang Exhibition Center Taipei, Taiwan | — | — |
| 2013 | 22–25 Oct 2013 | TWTC Nangang Exhibition Center Taipei, Taiwan | — | — |
| 2012 | 24–26 Oct 2012 | TWTC Nangang Exhibition Center Taipei, Taiwan | — | — |
| 2011 | 19–21 Oct 2011 | NTUH International Convention Center Taipei, Taiwan | — | — |
| 2010 | 20–22 Oct 2010 | TWTC Nangang Exhibition Center Taipei, Taiwan | — | — |
Past editions from the bvents archive (2008–2019) and organiser figures where they were published.