Conference · Bucharest, Romania
IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) 2012
Automation, Robotics, Manufacturing Technology · Design, Industrial Design · Electronics
Key numbers
- Floor space
- NULLin 2015, organiser's figure
- Editions on record
- 6first in 2010
About IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)
The International Symposium for Design and Technology in Electronic Packaging (SIITME) is a premier Central European event in the field of electronics industry, being from 1995 a scientific forum for exchanging of information between academia and industry from Central and Eastern Europe on the topics related to their experimental and theoretical work in the field of electronics and micro-systems, manufacturing technologies and advanced packaging.
The symposium combines the oral and poster presentations, in an attractive configuration, as well as individual meetings between professors, students, senior and young scientists who can discuss scientific and educational issues and organize future national and international cooperation. It is our pleasure to encourage you to participate to SIITME 2012, organized by “1 DECEMBRIE 1918″ University of Alba Iulia and Politehnica University of Bucharest, a top class, four days scientific event, between 25th and 28th October, 2012.
From our listing of this edition. Details may have changed since.
Editions
| Year | Dates | Where | Exhibitors | Visitors |
|---|---|---|---|---|
| 2015 | 24–27 Oct 2015 | Cornul Vanatorului Bucharest, Romania | — | — |
| 2014 | 24–27 Oct 2014 | Cornul Vanatorului Bucharest, Romania | — | — |
| 2013 | 24–27 Oct 2013 | Cornul Vanatorului Bucharest, Romania | — | — |
| 2012 | 25–28 Oct 2012 | Cornul Vanatorului Bucharest, Romania | — | — |
| 2011 | 20–23 Oct 2011 | Cornul Vanatorului Bucharest, Romania | — | — |
| 2010 | 23–26 Sep 2010 | Cornul Vanatorului Bucharest, Romania | — | — |
Past editions from the bvents archive (2008–2019) and organiser figures where they were published.