Conference · Bucharest, Romania
IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) 2013
Automation, Robotics, Manufacturing Technology · Design, Industrial Design · Electronics
Dates24–27 Oct 2013This edition has ended
RunningSince 2010Annual · 6 editions on record
Last checked12 Nov 2026Organiser website checked
This is the 2013 edition. It has ended. See IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)'s current page for the next dates.
Key numbers
- Floor space
- NULLin 2015, organiser's figure
- Editions on record
- 6first in 2010
About IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)
TOPICS
A. Emerging Technologies & Trends in Advanced Packaging
B. Power Electronics and Microsystems Packaging
C. Assembly and Manufacturing Technology
D. Design of Electronic Circuits and Systems
E. Electronics Simulation & Modelling
F. Electronics Applications
G. Optoelectronics & Advanced Communication Packaging
H. Applied Reliability
I. Challenge in Global Education
From our listing of this edition. Details may have changed since.
Editions
| Year | Dates | Where | Exhibitors | Visitors |
|---|---|---|---|---|
| 2015 | 24–27 Oct 2015 | Cornul Vanatorului Bucharest, Romania | — | — |
| 2014 | 24–27 Oct 2014 | Cornul Vanatorului Bucharest, Romania | — | — |
| 2013 | 24–27 Oct 2013 | Cornul Vanatorului Bucharest, Romania | — | — |
| 2012 | 25–28 Oct 2012 | Cornul Vanatorului Bucharest, Romania | — | — |
| 2011 | 20–23 Oct 2011 | Cornul Vanatorului Bucharest, Romania | — | — |
| 2010 | 23–26 Sep 2010 | Cornul Vanatorului Bucharest, Romania | — | — |
Past editions from the bvents archive (2008–2019) and organiser figures where they were published.