Conference · Bucharest, Romania
IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)
Automation, Robotics, Manufacturing Technology · Design, Industrial Design · Electronics
Key numbers
- Floor space
- NULLthis edition, organiser's figure
- Editions on record
- 6first in 2010
About IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)
TOPICS
A. Emerging Technologies & Trends in Advanced Packaging
B. Power Electronics and Microsystems Packaging
C. Assembly and Manufacturing Technology
D. Design of Electronic Circuits and Systems
E. Electronics Simulation & Modelling
F. Electronics Applications
G. Optoelectronics & Advanced Communication Packaging
H. Applied Reliability
I. Challenge in Global Education
From our listing of the 2013 edition. Details may have changed since.
Editions
| Year | Dates | Where | Exhibitors | Visitors |
|---|---|---|---|---|
| 2015 | 24–27 Oct 2015 | Cornul Vanatorului Bucharest, Romania | — | — |
| 2014 | 24–27 Oct 2014 | Cornul Vanatorului Bucharest, Romania | — | — |
| 2013 | 24–27 Oct 2013 | Cornul Vanatorului Bucharest, Romania | — | — |
| 2012 | 25–28 Oct 2012 | Cornul Vanatorului Bucharest, Romania | — | — |
| 2011 | 20–23 Oct 2011 | Cornul Vanatorului Bucharest, Romania | — | — |
| 2010 | 23–26 Sep 2010 | Cornul Vanatorului Bucharest, Romania | — | — |
Past editions from the bvents archive (2008–2019) and organiser figures where they were published.
Questions
When is IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)?
The next dates haven't been confirmed. The last edition we have on record was 24–27 Oct 2015.
Where is it held?
The 2010 edition was at Cornul Vanatorului, Bucharest, Romania. The organiser hasn't confirmed the venue for this edition yet.
How often does it take place?
Annual, judging by the 6 editions on record since 2010.