Exhibition · Tokyo, Japan
IC Packaging Technology Expo (ICP) 2011
Electronics · Semiconductor
Dates19–21 Jan 2011This edition has ended
RunningSince 2009Annual · 9 editions on record
Last checked11 Nov 2026Its old website no longer answers
This is the 2011 edition. It has ended. See IC Packaging Technology Expo (ICP)'s current page for the next dates.
Key numbers
- Exhibitors
- 150this edition, organiser's figure
- Visitors
- 64,000this edition, organiser's figure
- Editions on record
- 9first in 2009
About IC Packaging Technology Expo (ICP)
All kinds of products, technologies and services; equipment, device and material, that can contribute to miniaturization and thinning of cutting edge devices such as Semiconductors, LED, Power Devices, Sensors and MEMS will gather. ICP is an essential business venue for the specialists from a variety of fields to seek the packaging technology.
From our listing of this edition. Details may have changed since.
Editions
| Year | Dates | Where | Exhibitors | Visitors |
|---|---|---|---|---|
| 2018 | 17–19 Jan 2018 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2017 | 18–20 Jan 2017 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2015 | 14–16 Jan 2015 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2014 | 15–17 Jan 2014 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2013 | 16–18 Jan 2013 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2012 | 18–20 Jan 2012 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2011 | 19–21 Jan 2011 | Tokyo Big Sight Tokyo, Japan | 150 | 64,000 |
| 2010 | 20–22 Jan 2010 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2009 | 28–30 Jan 2009 | Tokyo Big Sight Tokyo, Japan | — | — |
Past editions from the bvents archive (2008–2019) and organiser figures where they were published.