Exhibition · Tokyo, Japan
IC Packaging Technology Expo (ICP) 2014
Electronics · Semiconductor
Key numbers
- Exhibitors
- 150in 2011, organiser's figure
- Visitors
- 64,000in 2011, organiser's figure
- Editions on record
- 9first in 2009
About IC Packaging Technology Expo (ICP)
All kinds of products, technologies and services that can contribute to miniaturization and thinning of cutting-edge devices such as Semiconductors, LED, Power Devices, Sensors and MEMS will gather here. ICP is an essential business venue for the professionals from a variety of fields to seek for packaging technologies.
Visitor Profile
Professionals of semiconductor assembly & electronics manufacturers in fields such as:
Production/Manufacturing, Engineering, SMT, Design, R&D, Quality Control, Purchasing, etc.
Visitors are from:
Semiconductor Manufacturers
Assembly Manufacturers/SATS
Sensor Manufacturers
Set Manufacturers (in high-density SMT)
MEMS Devices/LED Manufacturers
Automotive Electronics Manufacturers
From our listing of this edition. Details may have changed since.
Editions
| Year | Dates | Where | Exhibitors | Visitors |
|---|---|---|---|---|
| 2018 | 17–19 Jan 2018 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2017 | 18–20 Jan 2017 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2015 | 14–16 Jan 2015 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2014 | 15–17 Jan 2014 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2013 | 16–18 Jan 2013 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2012 | 18–20 Jan 2012 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2011 | 19–21 Jan 2011 | Tokyo Big Sight Tokyo, Japan | 150 | 64,000 |
| 2010 | 20–22 Jan 2010 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2009 | 28–30 Jan 2009 | Tokyo Big Sight Tokyo, Japan | — | — |
Past editions from the bvents archive (2008–2019) and organiser figures where they were published.