Exhibition · Tokyo, Japan
IC Packaging Technology Expo (ICP) 2012
Electronics · Semiconductor
Dates18–20 Jan 2012This edition has ended
RunningSince 2009Annual · 9 editions on record
Last checked11 Nov 2026Its old website no longer answers
This is the 2012 edition. It has ended. See IC Packaging Technology Expo (ICP)'s current page for the next dates.
Key numbers
- Exhibitors
- 150in 2011, organiser's figure
- Visitors
- 64,000in 2011, organiser's figure
- Editions on record
- 9first in 2009
About IC Packaging Technology Expo (ICP)
Gathers wide variety of Packaging Technologies for IC Devices!
All kinds of products, technologies and services that can contribute to miniaturization and thinning of cutting-edge devices such as Semiconductors, LED, Power Devices, Sensors and MEMS will gather here. ICP is an essential business venue for the professionals from a variety of fields to seek for packaging technologies.
From our listing of this edition. Details may have changed since.
Editions
| Year | Dates | Where | Exhibitors | Visitors |
|---|---|---|---|---|
| 2018 | 17–19 Jan 2018 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2017 | 18–20 Jan 2017 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2015 | 14–16 Jan 2015 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2014 | 15–17 Jan 2014 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2013 | 16–18 Jan 2013 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2012 | 18–20 Jan 2012 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2011 | 19–21 Jan 2011 | Tokyo Big Sight Tokyo, Japan | 150 | 64,000 |
| 2010 | 20–22 Jan 2010 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2009 | 28–30 Jan 2009 | Tokyo Big Sight Tokyo, Japan | — | — |
Past editions from the bvents archive (2008–2019) and organiser figures where they were published.