Exhibition · Tokyo, Japan
IC Packaging Technology Expo (ICP) 2015
Electronics · Semiconductor
Dates14–16 Jan 2015This edition has ended
RunningSince 2009Annual · 9 editions on record
Last checked11 Nov 2026Its old website no longer answers
This is the 2015 edition. It has ended. See IC Packaging Technology Expo (ICP)'s current page for the next dates.
Key numbers
- Exhibitors
- 150in 2011, organiser's figure
- Visitors
- 64,000in 2011, organiser's figure
- Editions on record
- 9first in 2009
About IC Packaging Technology Expo (ICP)
Variety of Packaging Technologies for IC Devices
Advanced products/technologies/services will be showcased, necessary for downsizing and advance of semiconductors, LEDs, power devices, sensors and MEMS devices. Must-attend show for all technical persons involved in IC packaging.
Special Exhibit Zones:
Semiconductor Device Inspection & Testing Zone
SATS/Contract Design Services Zone
Plating/Etching Zone
MEMS Packaging Zone
From our listing of this edition. Details may have changed since.
Editions
| Year | Dates | Where | Exhibitors | Visitors |
|---|---|---|---|---|
| 2018 | 17–19 Jan 2018 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2017 | 18–20 Jan 2017 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2015 | 14–16 Jan 2015 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2014 | 15–17 Jan 2014 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2013 | 16–18 Jan 2013 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2012 | 18–20 Jan 2012 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2011 | 19–21 Jan 2011 | Tokyo Big Sight Tokyo, Japan | 150 | 64,000 |
| 2010 | 20–22 Jan 2010 | Tokyo Big Sight Tokyo, Japan | — | — |
| 2009 | 28–30 Jan 2009 | Tokyo Big Sight Tokyo, Japan | — | — |
Past editions from the bvents archive (2008–2019) and organiser figures where they were published.